SOC chip lead

NXP Semiconductors · Pune Division

  • Experience15–16 yrs
  • SalaryNot disclosed
  • Work modeonsite
  • Posted1 Oct 2026
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About NXP Semiconductors

NXP Semiconductors is hiring in Pune Division in semiconductors electronics. This role looks for around 15+ years of experience.

Skills

  • SoC development
  • Architecture
  • RTL Design
  • Integration
  • Verification
  • DFT
  • Emulation
  • Physical Design
  • Silicon Validation
  • Project execution
  • Risk management

The role

A semiconductor SoC technical lead at a product semiconductor company drives SoC development, tape-out readiness, and silicon validation across architecture, RTL Design, and Physical Design. The role also applies project execution and risk management to coordinate cross-functional engineering teams and stakeholder reviews.

Full job description

Responsibilities

End-to-End Project Ownership: Own SoC program execution from project definition through tape-out and post-silicon support. Ensure on-time, high-quality delivery of key milestones and coordinate engineering support during silicon bring-up, validation, and debug.Technical Leadership: Drive technical decision-making across architecture, integration, verification, implementation, validation, and system teams. Serve as the overall technical execution owner for assigned projects.Cross-Functional Coordination: Lead and align Architecture, RTL, DFT, Verification, Emulation, Physical Design, AMS, IP, and related engineering teams. Resolve technical dependencies, execution bottlenecks, and critical project risks.Program Execution & Risk Management: Develop and maintain project execution plans together with PMO and SoC PM. Monitor schedule, resource demand, critical paths, and risk mitigation plans; drive recovery actions when milestones are at risk.Stakeholder Management: Partner with Product Marketing, System Architecture, System Engineering, NPI PM, BU management, and external stakeholders. Communicate project status, technical readiness, key risks, and mitigation plans during management and milestone reviews.Tape-Out & Silicon Readiness: Own overall tape-out readiness, including integration quality, signoff closure, cross-functional alignment, and risk management. Coordinate post-silicon validation activities and engineering resources to support silicon bring-up and issue resolution.

Requirements

Bachelor's degree or higher in Microelectronics, Electrical Engineering, or related disciplines.15+ years of semiconductor industry experience.Proven experience in SoC development from architecture through tape-out.Strong understanding of SoC development flows including: Architecture, RTL Design, Integration, Verification, DFT, Emulation, Physical Design, Silicon Validation.Experience leading large cross-functional engineering teams.Strong project execution, planning, and risk management skills.Excellent communication, leadership, and stakeholder management capabilities.Ability to influence technical direction and drive execution in a matrix organization.

Preferred Qualifications

Previous experience as: Chip Lead / SoC Technical Lead / Chief Engineer / Project Technical LeaderExperience with automotive, industrial, or safety-critical semiconductor products.Experience working with global development teams across multiple sites.Successful delivery of multiple SoC tape-outs and post-silicon product ramps.

Core Competencies

Technical LeadershipCross-functional CollaborationProject Execution ExcellenceRisk ManagementStrategic ThinkingProblem Solving & Decision MakingStakeholder ManagementCommunication & InfluenceCustomer FocusResults Orientation

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