Lead Engineer-Thermal
Qualcomm · Hyderabad
- Experience3–4 yrs
- SalaryNot disclosed
- Work modeonsite
- Posted25 Sept 2026
About Qualcomm
Qualcomm is hiring in Hyderabad in semiconductors electronics. This role looks for around 3+ years of experience.
Skills
- Power optimization
- Thermal management
- CPU performance management
- C++
- Python
- C
- Java
- Power and performance telemetry
- Thermal throttling
- Power and thermal co-optimization
- Lab measurements
- Workload-based testing
- Simulation-to-lab correlation
- Server mechanical and airflow design
The role
A thermal engineer at a semiconductor company designs power and thermal solutions for server-class SoCs, applying CPU performance management and C++ to optimize silicon and platform behavior. The role also uses Python for lab correlation and workload testing.
Full job description
Company:
Qualcomm India Private Limited
Job Area:
Engineering Group, Engineering Group > Software Engineering
General Summary:
Qualcomm PPAT Team is looking for Power and Thermal Engineers to design, analyze, and Optimize Power and provide T hermal solutions for high-power CPU based server-class SoCs . Candidate will work closely with silicon design, power architecture, package, platform, and system teams to ensure reliable power and performance across critical server environments.
This role is ideal for engineers with hands-on experience in CPU / GPU / accelerator power and performance management , especially from Intel, AMD, NVIDIA, or similar semiconductor companies working on data center, cloud server, and similar products .
Key Responsibilities:
Power Optimization and Thermal Solution Development
Power Features Enablement, Analysis and Optimizations
CPU performance and state management
CPU and System Idle state management
Power and Performance telemetry
Define and evaluate thermal solutions:
Limits management
Heat sinks, vapor chambers, cold plates
TIM selection and optimization
Thermal and Throttling state management
Collaborate with platform teams on server mechanical and airflow design.
Support power- thermal co-optimization during silicon bring-up.
Validation & Correlation
Define and execute power and thermal execution plans:
Lab measurements (power breakdown, thermocouples)
Power virus and workload-based testing
Correlate simulation vs lab data and drive design improvements.
Cross-Functional Collaboration
Partner with:
Silicon design & power teams
Platform, BIOS, and firmware teams
External ODM/OEM and cooling vendors
Provide thermal guidance during platform bring-up and customer engagements.
Minimum Qualifications:
Bachelor's degree in Engineering, Information Systems, Computer Science, or related field and 3+ years of Software Engineering or related work experience.
OR
Master's degree in Engineering, Information Systems, Computer Science, or related field and 2+ years of Software Engineering or related work experience.
OR
PhD in Engineering, Information Systems, Computer Science, or related field and 1+ year of Software Engineering or related work experience.
2+ years of academic or work experience with Programming Language such as C, C++, Java, Python, etc.
Required Qualifications
Education
Bachelor’s or Master’s degree in Computer Science, Electronics, Electrical Engineering, or related field.
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