Lead Engineer-Thermal

Qualcomm · Greater Hyderabad Area

  • Experience3–4 yrs
  • SalaryNot disclosed
  • Work modeonsite
  • Posted25 Sept 2026
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About Qualcomm

Qualcomm is hiring in Greater Hyderabad Area in semiconductors electronics. This role looks for around 3+ years of experience.

Skills

  • power management
  • thermal management
  • CPU performance management
  • thermal throttling
  • power and performance telemetry
  • server mechanical design
  • airflow design
  • silicon bring-up
  • BIOS
  • firmware
  • power measurement
  • thermocouples
  • workload-based testing
  • C/C++
  • Python
  • Computer Science
  • Electronics
  • Electrical Engineering

The role

A power and thermal engineer at a semiconductor company designs CPU, GPU, and accelerator power management solutions, validates thermal performance, and optimizes server-class systems using C/C++ and Python.

Full job description

Company

Qualcomm India Private Limited

Job Area

Engineering Group, Engineering Group > Software Engineering

General Summary

Qualcomm PPAT Team is looking for Power and Thermal Engineers to design, analyze, and Optimize Power and provide Thermal solutions for high-power CPU based server-class SoCs. Candidate will work closely with silicon design, power architecture, package, platform, and system teams to ensure reliable power and performance across critical server environments.

This role is ideal for engineers with hands-on experience in CPU / GPU / accelerator power and performance management, especially from Intel, AMD, NVIDIA, or similar semiconductor companies working on data center, cloud server, and similar products.

Key Responsibilities

Power Optimization and Thermal Solution Development

Power Features Enablement, Analysis and OptimizationsCPU performance and state managementCPU and System Idle state managementPower and Performance telemetry

Define and evaluate thermal solutions:Limits managementHeat sinks, vapor chambers, cold platesTIM selection and optimizationThermal and Throttling state management

Collaborate with platform teams on server mechanical and airflow design.Support power-thermal co-optimization during silicon bring-up.

Validation & Correlation

Define and execute power and thermal execution plans:Lab measurements (power breakdown, thermocouples)Power virus and workload-based testing

Correlate simulation vs lab data and drive design improvements.

Cross-Functional Collaboration

Partner with:Silicon design & power teamsPlatform, BIOS, and firmware teamsExternal ODM/OEM and cooling vendors

Provide thermal guidance during platform bring-up and customer engagements.

Minimum Qualifications

Bachelor's degree in Engineering, Information Systems, Computer Science, or related field and 3+ years of Software Engineering or related work experience.

OR

Master's degree in Engineering, Information Systems, Computer Science, or related field and 2+ years of Software Engineering or related work experience.

OR

PhD in Engineering, Information Systems, Computer Science, or related field and 1+ year of Software Engineering or related work experience.

2+ years of academic or work experience with Programming Language such as C, C++, Java, Python, etc.

Required Qualifications

Education

Bachelor’s or Master’s degree in Computer Science, Electronics, Electrical Engineering, or related field.

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