SR MGR R&D/PRODUCT DVL ENGINEERING - Signal Integrity

Job OverviewCompanyTE Connectivity Ltd. is a $17.3 billion global technology and manufacturing leader creating a safer, sustainable, productive, and connected future. For more than 75 years, our connectivity and sensor solutions, proven in the harshest environments, have enabled advancements in transportation, industrial applications, medical technology, energy, data communications, and the home. With 80,000 employees, including more than 8,000 engineers, working alongside customers in approximately 140 countries, TE ensures that EVERY CONNECTION COUNTS. Learn more at www.te.com BU / FunctionDigital Data & Networks (DDN) Business Unit in TE Connectivity, where we enable high-speed connectivity solutions that power today’s and tomorrow’s data-driven world. Engineering team is responsible for development of innovative interconnect solution products which are used in hyperscale computers, AI, Datacenter, Cloud server, and other IT systems, including connectors, cable assemblies, bus bars and sockets. We engineer and manufacture cutting-edge interconnect solutions that support high-speed data transmission, signal integrity, and power efficiency.

Role OverviewAs a manager in the Signal Integrity team you will lead the SI engineers focusing on aspects of electrical design, simulation, and verification-validation testing of high speed interconnect products such as connector and/or cable assembly, radio system industry—targeting high speed communications and connectivity within datacenters and wireless infrastructure. You will be expected to drive development teams in the areas of signal integrity for product and system design including modeling, simulation, testing and circuit board layout. You will work collaboratively within a broader cross functional team of mechanical, manufacturing, & operations to execute leading edge products designs. You will assign resources to work on the signal integrity performance of a product/platform beginning with the initial analysis through prototype fabrication & evaluation, and production verification testing. You will be expected to coordinate to drive the advancement of simulation tools and capabilities, identifying potential areas of process improvement, and solving complex problems and ensuring product development success.Responsibilities:Align the technology roadmap with front end / customer, and implement accordinglyFamiliar with signal integrity design, simulation and validation activities through product development cyclesCoordinate to define signal integrity design performance/functional requirements for new products by closely engaging with front teams / lead customersGuide the team to preform signal integrity simulations for multiple high-speed standards on each product, including determining the correct simulation methodology, as well as a good understanding of the criteria for each interface.Driving product development for business successEngaging in innovative simulation and test tool improvement and process enhancementDriving best practices and efficiency in connector design and component qualifications from a signal integrity standpoint.Being a mentor and teacher to other engineers across disciplines / BUs, writes and presents technical papers at internal and external conferences. Being an expert in analyzing competitive products and driving internal & competing IP positionsCandidate Desired Profile:Required Skills/Experience:Bachelor’s degree in electrical engineering or equivalent work experience; Master’s degrees highly recommendedMinium of 20 years of relevant work experience in electrical design, RF design, with 8+ years managerial experience in leading an electrical or SI engineering teamFamiliar with signal integrity analysis tools (Agilent ADS, Ansys HFSS, CST, or equivalent tools)A solid understanding of electromagnetic theory and electrical circuit behaviorGood analytical capabilities to interpret simulation and lab data to identify issues and provide guidance to team to fix identified problem.Familiarity with printed circuit board design, fabrication and assembly. Fluent in English (both verbal and written) to facilitate global communication both internally and with external customers.Strong background to work in a global environment – able to accommodate varying time zones and capable of collaborating with individuals across geographies.Ability to, and experience with, teaching and training peers in applying software tools and methodologies, and in the use of electrical test equipment, including VNA’s and TDR’sIndividual must be highly motivated, a quick learner, and able to work independently

Nice to Have Skills/Experience:Experience with interconnect design, including socket/connector/cable/cable assembly design (high-speed twinax or coaxial cables, direct attach copper (DAC) cables), and/or RF antenna, RF sub-systemDesign experience with communication systems (high-speed servers, switches, routers, storage, antennas, RF front end or similar systems)Solid presentation skills with an ability to clearly communicate technical concepts to diverse audiences in EnglishStrong organizational and time management skills with an ability to manage and execute multiple tasks/deadlines/projects simultaneously with limited direction.Printed circuit board design, fabrication and assembly (Altium, AutoCAD)Test equipment (oscilloscope, vector network analyzer, BERT)Signal conditioning techniques (equalization, amplification)Direct customer design and support experienceApplication and test knowledge of high-speed devices and equalization techniques

Motivation/Cultural Fit:• Passion for technology• Talent development• Good communication skills and proactively communicate with team members and Customers• Effective planning & Prioritization